目錄
Catalog 培訓(xùn)內(nèi)容/時(shí)間
Course Title 課程內(nèi)容
Content
可靠性
Reliability 可靠性、質(zhì)量認(rèn)證及測試
Reliability, Qualification and test
0.5 天
0.5 day ? 微電子器件及微系統(tǒng)簡介Brief introduction of microelectronic devices and micro-electronic systems
? 可靠性描述和浴盆曲線 Reliability description and bathtub curve
? 常見可靠性模型和加速因子估算 Common reliability model and active factor estimation
? 可靠性試驗(yàn)和認(rèn)證 Typical reliability tests
? 器件結(jié)構(gòu)分析 Package construction analysis
可靠性
Reliability 塑料封裝器件的潮氣敏感性及相關(guān)問題
Moisture Sensitivity and Relevant Issues
0.5 天
0.5 day ? 塑料封裝器件中的水汽擴(kuò)散、回流焊接過程中濕氣蒸發(fā)引起的分層、爆裂等失效現(xiàn)象 Moisture diffusion in plastic packages, moisture induced failure modes such as delamination, popcorn crack, etc.
? 器件濕氣敏感性分級：JESD020: 非氣密性表面封裝固態(tài)電路的水汽/回流敏感性等級 Moisture sensitivity level: JESD020: Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
? 如何判斷與濕氣敏感性相關(guān)的失效的根本原因：器件質(zhì)量還是電子組裝？How to judge the root cause when popcorn crack happens: device quality or SMT problem?
? 器件懷疑吸濕如何處理：實(shí)用指南 What to do, if your devices are susceptible of excessive moisture absorption: a practical guide
可靠性
Reliability 電子器件靜電防護(hù)和過電損傷
ESD and EOS
0.5 天
0.5 day ? 靜放電/電過應(yīng)力基本概念介紹 ESD/EOS definition and distinguish
? 器件/系統(tǒng)靜放電評估和實(shí)驗(yàn)方法 Component level ESD while system level ESD evaluation and test
? 靜放電控制和檢查 Typical ESD control and checklist in manufacture process
? 電過應(yīng)力預(yù)防和根因分析難點(diǎn) Typical EOS prevention and challenge of root cause identification
? 典型案例 Case study
可靠性
Reliability 器件焊接性能評價(jià)方法及標(biāo)準(zhǔn)
Test method and standard for component solderability evaluation
0.5 天
0.5 day ? 無鉛焊相關(guān)的常見標(biāo)準(zhǔn) Common standards for lead free soldering
? 無鉛焊的潤濕性評價(jià)試驗(yàn) Solderability tests and evaluation for lead free soldering
? 無鉛焊點(diǎn)強(qiáng)度試驗(yàn)方法 Testing of solder joint strength for lead free soldering
? 無鉛焊點(diǎn)壽命機(jī)械試驗(yàn)方法 Lead free solder joint lifetime test with mechanical method
