關(guān)于電子封裝失效分析培訓班的通知
培訓時間:2010年6月30日-7月1日(具體時間待定)
培訓地點:上海浦東張江高科技園區(qū)蔡倫路333號浦東創(chuàng)新港
培訓費用:2500元/人/2天
付款方式:培訓前完成付款
我司銀行資料:
開戶銀行:農(nóng)行金橋?qū)O橋現(xiàn)代農(nóng)業(yè)開發(fā)區(qū)支行
公司名稱:上海耀谷管理咨詢有限公司
內(nèi)容簡介:
Category Course Title Content
類別 培訓內(nèi)容 課程內(nèi)容
QFA1: ? 電子封裝簡介
Brief introduction of electronic package
Failure Analysis on Electronic Packaging ? 失效定義及分類
Definition and classification of failures
? 電子產(chǎn)品為何失效
Why do electronic products fail
? 失效分析的目標
The objectives of failure analysis
電子封裝失效分析 ? 失效分析的重要性
Understand the importance of failure analysis
? 失效分析的思想方法
Philosophical approach of failure analysis
0.5 day ? 失效分析技術(shù)線路
0.5 天 Technique approach of failure analysis
?
Failure analysis flow charts
? 元器件典型失效模式和機理
Typical failure modes and failure mechanisms of electronics components
QFA2: ? 產(chǎn)品可靠性浴盆曲線
Reliability Tests and Qualification of Plastic Packaged Ics Product reliability and bathtub curve
? 篩選試驗,可靠性試驗,可靠性認證
Screening tests, reliability tests, qualification tests
? 常見可靠性試驗、目的、誘導的典型失效模式及機理等
可靠性試驗及封裝認證 Common reliability tests, objectives, typical failure modes and mechanisms
? 典型集成電路塑料封裝器件的封裝認證標準簡介
0.5 day Typical standards on package qualification of plastic packaged ICs
0.5 天 ? 器件結(jié)構(gòu)分析
Package construction analysis
QFA3: ? 塑料封裝器件中的水汽擴散、回流焊接過程中濕氣蒸發(fā)引起 的分層、爆裂等失效現(xiàn)象
Moisture Sensitivity and Relevant Issues Moisture diffusion in plastic packages, moisture induced failure modes such as delamination, popcorn crack, etc.
? 器件濕氣敏感性分級:JESD020C:非氣密性表面封裝固態(tài)電路的水汽/回流敏感性等級
Moisture sensitivity level: JESD020C: Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
塑料封裝器件的潮氣敏感性及相關(guān)問題 ? 如何判斷與濕氣敏感性相關(guān)的失效的根本原因:器件質(zhì)量還是電子組裝?
0.5 day How to judge the root cause when popcorn crack happens: device quality or SMT problem?
0.5 天 ? 器件懷疑吸濕如何處理:實用指南
What to do, if your devices are susceptible of excessive moisture absorption: a practical guide
QFA4: ? 焊接界面形成
Solidification and interface intermetallics formation
Soldering & Solder Joint Failure Analysis ? 電子產(chǎn)品服役過程中焊料組織及界面金屬間化合物的演化及其與焊點失效的關(guān)系
Evolution of solder micro-structure and interface intermetallics and effects on solder joint lifetime
焊接及焊點失效分析 ? 影響焊點壽命的典型設計、工藝、材料等因素
0.5 day Typical design, material, process parameters affecting soldering joint lifetime
0.5 天 ? 焊點失效分析流程
Typical flow chart for solder joint failure analysis
? 焊點失效典型模式及分析方法
Typical failure modes and analysis method